As Advanced Electronic Packaging form factors continue to shrink, and the demand for such packages continues to grow, industry leaders are turning to Stoelting to ensure completely clean and dry product. For many in the semiconductor industry, successful flip chip cleaning had been limited to relatively low volume (batch) solvent-based centrifugal cleaning systems. Now, with Stoelting’s OmniJet Advanced Packaging In-Line Aqueous Cleaning System (APILACS), achieving completely clean (no flux residue) and dry (no moisture) flip chip product, in a high production, aqueous environment, is guaranteed. The OmniJet APILACS’s proprietary spray and air-flow system ensures clean and dry product even in high production, in-line environments. Because of the systems powerful cleaning and drying capabilities, it’s not uncommon to have two assembly lines feeding one OmniJet APILACS cleaner, resulting in considerable cost savings to the customer. The OmniJet APILACS was designed for the semiconductor industry, with SMEMA compatible handling interface and SEMI S2 93 safety standards. The OmniJet’s stainless steel construction ensures the customer years of trouble free operation. Don’t limit yourself to low volume, solvent based batch/centrifugal systems when you can achieve completely clean and dry product with Stoelting’s OmniJet Advanced Packaging In-Line Aqueous Cleaning System.
